July 08, 2010
By: by The Business Review
A Japanese company that makes tools for the semiconductor industry will partner with Sematech at the University at Albany's nanocollege on improving the manufacturing of future computer chips.
Lasertec Corp. of Yokohama, Japan, has joined Sematech's 3D Interconnect Program at UAlbany's College of Nanoscale Science and Engineering. The 3D Interconnect was formed in 2007 to help develop technology that allows chips to be built on top of one another, known as three-dimensional stacking. The 3D program's goal is to make high-volume manufacturing of the chips available to Sematech's members at a lower cost and higher performance. Sematech is a consortium of computer chip makers. It has offices in Austin, Texas, and the nanocollege located on the Albany NanoTech campus.
Lasertec's tool that will be located at UAlbany is used in the fields of metrology and inspection.
Sematech did not immediately return a call seeking information on how many Lasertec employees would be locating at Albany NanoTech.