October 29, 2007
By: by SEMATECH
Sapporo, Japan (29 October 2007) - SEMATECH engineers have made significant advances in moving forward the infrastructure that will prepare extreme ultraviolet lithography (EUVL) for cost-effective manufacturing, according to papers being presented here at the 2007 International EUVL Symposium.
An outstanding set of SEMATECH-led technical achievements and breakthroughs in EUVL are featured in nine papers from SEMATECH authors and seven partner papers involving lithographers from the global consortium. The research leading to these accomplishments took place at SEMATECH's facilities at the College of Nanoscale Science and Engineering (CNSE) in Albany, NY, and demonstrates the consortium's commitment to deliver cost-effective manufacturing solutions to its member companies and the semiconductor industry.
"SEMATECH continues to produce results that chip-makers need to show that EUVL is manufacturable," said Michael Lercel, Lithography director. "Here at the EUVL Symposium, we're showing practical results for mask blank defect reduction, more efficient optical system designs, effective reticle handling, and other areas that help drive cost, which is emphasized in our cost-of-ownership models."
"The significant advances made by SEMATECH researchers and engineers working at the UAlbany NanoCollege demonstrate SEMATECH's leadership in spurring next-generation advances in nanoelectronics, which is enhanced by its growing presence and partnership at CNSE's Albany NanoTech," said Dr. James G. Ryan, professor of nanoscience and associate vice president of technology at CNSE. "This represents another important step forward in the development and commercialization of EUVL technology, which is seen as vital to the future of nanoelectronics manufacturing."
Following is a sampling of advances revealed by SEMATECH technologists in papers being delivered at the symposium:
"SEMATECH continues to move beyond theory and alpha concepts to deliver manufacturable EUV solutions for our member companies and the industry," Lercel said. "We are leading EUV mask blank development with the world's best defect inspection and characterization capability and multilayer deposition capability, and leading-edge imaging capability for EUV photoresists."
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