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6/10/2010 9:02:00 AM

Nanotechnology Now: SEMATECH Achieves Submicron 3D IC Bond Alignment Results in Integrated Bonding Tool Platform at UAlbany NanoCollege

Nanotechnology Now

Albany, NY & San Francisco, CA | Posted on June 10th, 2010

Researchers from SEMATECH's 3D Interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex have reported advances in wafer-to-wafer bonding alignment accuracies through a series of tool and process hardening improvements. At the same time, the SEMATECH team has explored unique 3D metrology and failure analysis techniques to complement bonding tool development. These results are key steps towards bridging high-volume manufacturing readiness gaps for an integrated bonding tool platform and developing metrology techniques that will accelerate adoption of 3D integration technology. SEMATECH presented the results at the 2010 IEEE International Interconnect Technology Conference (IITC) on Wednesday, June 9, in Burlingame, CA. Full Article