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3-D Integration

Case Number Disclosure Title Inventor(s)
RN2-12-13
New contact hole (or trench) shrink method by using organic overcoating material for NTD (negative tone developer) process
Jun Sung Chun
RN2-12-02
Integration of Through Silicon Vias (TSVs) in a standard CMOS process flow using pre-contact processing
Jeremiah Hebding; Megha Rao; Colin McDonough; Matthew Smalley; Douglas Coolbaugh; Joseph Piccirillo; Stephen Bennett; Michael Liehr
RN2-12-01
Thin Die to wafer thermal compression bonding using novel handling and bonding techniques
Jeremiah Hebding; Megha Rao; Colin McDonough; Matthew Smalley; Douglas Coolbaugh; Joseph Piccirillo; Stephen Bennett; Michael Liehr
RN2-11-16
Carbon nanotube growth on silicon and silicon nanowire substrates via simultaneous delivery of carbon and catalyst via plasma enhanced atomic layer deposition (PEALD)
Jae Ho Lee; Issac Lund; Eric Eisenbraun; Robert Geer
RN2-09-01A Spatial Tuneable Pressure Plates for bonding wafer to wafer/die to wafer applications Altemus, Bruce
RN2-09-01 Piezoelectric Sensor Array for Pressure Uniformity/Spatial Verification Altemus, Bruce
R2-08-22 Reconfigurable 3d TSV technology for defense applications Wang, Wei
R2-08-05 Three-Dimensional Architecture for Integration of CMOS Circuits and Nano-Material in Hybrid Digital Circuits Wang, Wei
R2-07-16 Method of Determining Genetic Sequences for Controlled Complex Assembly Hartley,John ; Raghunathan, Sudharashanan; Ruan, Junru; Ozkan, Mihrl ; Akin, Rngin
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CMP

Case Number Disclosure Title Inventor(s)
RN2-09-11 In-Situ Confined Plasma Channel Source for Enhanced Thin Films Uniformity Stewart, Stephen L.
RN2-09-09 Built-in CMP pad End-of-Life-Monitor Borst, Christopher
RN2-09-01A Spatial Tuneable Pressure Plates for bonding wafer to wafer/die to wafer applications Altemus, Bruce
RN2-09-01 Piezoelectric Sensor Array for Pressure Uniformity/Spatial Verification Altemus, Bruce

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CVD

Case Number Disclosure Title Inventor(s)
RN2-11-16
Carbon nanotube growth on silicon and silicon nanowire substrates via simultaneous delivery of carbon and catalyst via plasma enhanced atomic layer deposition (PEALD)
Jae Ho Lee; Issac Lund; Eric Eisenbraun; Robert Geer
R904-320 Process and apparatus for the use of solid precursor sources in liquid form for vapor deposition of materials Kaloyeros , Alain E.; Eisenbraun, Eric T.; Zheng, Bo
R855-320 A Temperature-Controlled Chemical Vapor Deposition (TC-CVD) Process for the Growth of High Temperature Superconductors Kaloyeros, Alain E.; Feng, Aiguo
R741-320 Low-Temperature Metal-Organic Chemical Vapor Deposition (Ltmocvd) of Copper for Microelectronic Device Applications Kaloyeros, Alain E.; Toscano, Paul J.; Corbett, James W.
R2-06-15 Direct Closed Loop Proportional-Integral- Derivaive (PID) Substraite Temperature Control for a Molecular Beam Epilaxy (MBE) Machine Via Input from a Band-Edge temperature measurement system LaBella, Vincent; Awo-Affouda, Chaffra; Stollenwerk, Andrew
R2-00-02 Interlayer Mediated Epitaxy of Cobalt Silicide from Low Temperature Chemical Vapor Deposition of Cobalt Kaloyeros, Alain E.;Arkles, Barry (Gelest);Londergran, Ana
R1110-320 Methods for Chemical Vapor Deposition and Preparation of Conformal Titanium-Based Films Kaloyeros, Alain; Arkles, Barry

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Deposition

Case Number Disclosure Title Inventor(s)
RN2-12-11 Combination Metal/Poly gate stack for FINFET Vidya Kaushik
RN2-11-16
Carbon nanotube growth on silicon and silicon nanowire substrates via simultaneous delivery of carbon and catalyst via plasma enhanced atomic layer deposition (PEALD)
Jae Ho Lee; Issac Lund; Eric Eisenbraun; Robert Geer
S846-320 Process for Etching, Depositing, and Treating Materials Using a Flowing Afterglow (FA) Plasma Technique Corbett, James W.; Yencha, Andrew J.
S839-320 Process for Focusing Gases to Etch and/or Deposit Materials and Confine Reactions to Localized Sites Corbett, James W.; Gibson, Walter M.; Kaloyeros, Alain E.
S836-320 Process for Making Improved Silicon-Germanium Alloys by Low-Temperature Metal-Organic Chemical Vapor Deposition Kaloyeros, Alain E.; Corbett, James W.; Barbero, Christopher; Toscano, Paul J.
S829-320 Process to Etch and/or Deposit Features with Nanometer Dimensions Corbett, James W.; Kaloyeros, Alain E.;Gibson, Walter M.
S781-320 Processes for Generating a Novel Electrode for use in Etching, Deposition and Breakdown Systems Corbett, James W.; Kaloyeros, Alain E.
S742-320 Improved Process for Producing Amorphous Silicon (a-Si) Corbett, James W.; Kaloyeros, Alain E.; Toscano, Paul J.
S740-320 Process for the Growth of an Overlayer of Crystalline or Polycrystalline Material Corbett, James W.; Kaloyeros, Alain E.
S714-320 Novel Process for Nanometer Dimension Etched and Deposition of Devices and Components Corbett, James W.; Kaloyeros, Alain E.
RN2-09-16 Method of creating Cs-free III-Nitride based Photocathodes Shahedipour-Sandvik, Fatemeh; Tripathi, Neeraj
RN2-09-11 In-Situ Confined Plasma Channel Source for Enhanced Thin Films Uniformity Stewart, Stephen L.
RN2-09-08 Bandgap Engineering in Mono-and Multi-layer Graphene via formation of Interface charges Shahedipour-Sandvik, Fatemeh
RN2-09-02 nMOS-Junction Logic Design Wang, Wei
R2-02-03 Real Time Processing Capillary Electrophoresis Method and Fabrication Using MEMS Technology Dong ,Yan; Xu, Bai; Castracane, James
R99-09-320 Silver Precursors for CVD Processes Welch, John T.;Ngo, Silvana C.;Banger, Kulbinder K.
R99-08-320 MOCVD Processes Using Precursors Based on Organometalloid Ligands Welch, John T., Claessen, Rolf;Banger, Kulbinder K.;Kaloyeros, Alain E.;Toscano, Paul J.;Kornilov, Andrei
R99-07-320 Chemical Source and Processes for Tungsten Nitride Deposition Kaloyeros, Alain
Arkles, Barry
R98-02-320.2 MOCVD Precursors based on Organometalloid Ligands Welch, John T. Claessen, Rolf Banger, Kulbinder K. Toscano, Paul J., Kornilov, Andrei
R98-02-320.1 MOCVD Precursors based on Organometalloid Ligands Welch, John T. Claessen, Rolf Banger, Kulbinder K. Toscano, Paul J., Kornilov, Andrei
R97-04-320 Slicon Based Films Formed from Iodosilane Precursors and Method of Making the Same Kaloyeros, Alain E., Arkles, Barry (Gelest), Chen, Xiaomeng, Endisch, Denis, Lin, Xian
R97-03-320 Silicon Nitrogen-Based Films and Method of Making the Same Kaloyeros, Alain E., Arkles, barry (Gelest)
R96-04-320.2 Method for Chemical Vapor Deposition of Copper-Based Films and Copper Source Precursors for the Same Kaloyeros , Alain E.; Eisenbraun, Eric T.; Zheng, Bo
R96-04-320.1 Method for Chemical Vapor Deposition of Copper-Based Films and Copper Source Precursors for the Same Kaloyeros, Alain
Arkles, Barry
R905-320 A Universal Chemical Vapor Deposition Process for the Selective Growth of Metals Kaloyeros, Alain E.
R904-320 Process and apparatus for the use of solid precursor sources in liquid form for vapor deposition of materials Kaloyeros , Alain E.; Eisenbraun, Eric T.; Zheng, Bo
R855-320 A Temperature-Controlled Chemical Vapor Deposition (TC-CVD) Process for the Growth of High Temperature Superconductors Kaloyeros, Alain E.; Feng, Aiguo
R743-320 Metal-Organic Vapor Phase Epitaxy (Movpe) of High Temperature Superconductors Kaloyeros, Alain E.; Corbett, James W.
R741-320 Low-Temperature Metal-Organic Chemical Vapor Deposition (Ltmocvd) of Copper for Microelectronic Device Applications Kaloyeros, Alain E.; Toscano, Paul J.; Corbett, James W.
R239-320 Method for Introducing Hydrogen into Semiconductors Corbett, James W.
R2-08-16 Split gate method for MOSFET Wang, Wei; Hartley, John
R2-07-10 Controloble Surface Roughness Brainard, Robert; Hirschbein, Bernard; Gadre,Anand
R2-06-15 Direct Closed Loop Proportional-Integral- Derivaive (PID) Substraite Temperature Control for a Molecular Beam Epilaxy (MBE) Machine Via Input from a Band-Edge temperature measurement system LaBella, Vincent; Awo-Affouda, Chaffra; Stollenwerk, Andrew
R2-05-03 Above Room temperature Ferromagnetic Silicon LaBella, Vincent Patrick; Bolduc, Martin ; Awo-Affouda, Chaffra; Huang, Mengbing
R2-03-10 MEMS Structure with Anodically Bonded Silicon-on-Insulator Substrate Xu, Bai, Tokranova, Natalya; Castracane James
R2-03-07 Methods for forming palladium alloy thin films and optical hydrogen sensors employing palladium alloy thin films Carpenter, Michael A.; Zhao, Zhouying
R2-02-04 Substrate Engineering Technique for Low Dislocation Defect III-Nitride Wideband Gap Material (AllnGaN) Growth on Silicon Substrate Shahedipour-Sandvik, Fatemeh; Wu, Di, Kahn, Muhammad Jamil
R2-00-02 Interlayer Mediated Epitaxy of Cobalt Silicide from Low Temperature Chemical Vapor Deposition of Cobalt Kaloyeros, Alain E.;Arkles, Barry (Gelest);Londergran, Ana

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Etch

Case Number Disclosure Title Inventor(s)
RN2-12-13
New contact hole (or trench) shrink method by using organic overcoating material for NTD (negative tone developer) process
Jun Sung Chun
RN2-12-07 Method for reducing charging in the CD SEM Melvin “Warren” Montgomery; Cecelia Montgomery (SEMATECH); Ben Bunday (SEMATECH)
S846-320 Process for Etching, Depositing, and Treating Materials Using a Flowing Afterglow (FA) Plasma Technique Corbett, James W.; Yencha, Andrew J.
S839-320 Process for Focusing Gases to Etch and/or Deposit Materials and Confine Reactions to Localized Sites Corbett, James W.; Gibson, Walter M.; Kaloyeros, Alain E.
S829-320 Process to Etch and/or Deposit Features with Nanometer Dimensions Corbett, James W.; Kaloyeros, Alain E.;Gibson, Walter M.
S781-320 Processes for Generating a Novel Electrode for use in Etching, Deposition and Breakdown Systems Corbett, James W.; Kaloyeros, Alain E.
S746-320 Improved Process for Nano-Dry-Etching Corbett, James W.; Kaloyeros, Alain E.
S714-320 Novel Process for Nanometer Dimension Etched and Deposition of Devices and Components Corbett, James W.; Kaloyeros, Alain E.
R1185-320 Highly Selective Chemical Dry Etrching of Silicon Nitride Over Silicon and Silicon Dioxide Oehrlein, Gottlieb; Kastenmeier, Bernd; Matsuo, Peter

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Integration

Case Number Disclosure Title Inventor(s)
RN2-11-25
Method of Fabricating a Partial or Full Replacement Gate using Amorphous Carbon as the Mandrel
Stamper, Harlan; Bennett, Steve; Rodgers, Martin; St. Louis, Jeff; Franca, Dan
RN2-11-15 Amorphous Carbon and Side Wall Image Transfer (SIT) Stamper, Harlan
RN2-11-14 Method of fabricating a RERAM Device Utilizing a Spacer Vertical Sidewall Hard Mask Approach Stamper, Harlan; Bennett, Steve; Li, Hui-Feng

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Lithography

Case Number Disclosure Title Inventor(s)
RN2-12-13 New contact hole (or trench) shrink method by using organic overcoating material for NTD (negative tone developer) process Chun, Jun Sung
RN2-12-07 Method for reducing charging in the CD SEM Melvin “Warren” Montgomery; Cecelia Montgomery (SEMATECH); Ben Bunday (SEMATECH)
S830-320 Processes for Form Images with Nanometer Dimensions Corbett, James W.; Gibson, Walter M.; Kumakhov, Muradin A.
S747-320 Process for Generating a Lithographic Pattern Corbett, James W.; Kaloyeros, Alain E.
S745-320 Improved Method for Making a Mask and a Lithographic Pattern Corbett, James W.; Kaloyeros, Alain E.
RN2-09-15 Parallel Beam Scanning Mask Inspection Denbeaux, Greg
R2-08-16 Split gate method for MOSFET Wang, Wei; Hartley, John
R2-08-15 Digital Deflection system for Changed Particle Applications Hartley, John
R2-08-14 Porous Micro-Heater for Surface Dusruption and Controllled Sampling of Fluids Gadre, Anand
R2-08-11 Use of confined plasma as an Extreme Ultraviolet light source Denbeaux, Gregory; Goodwin, Francis
R2-08-10 Nano/Viral Sensor Conjugated Polymeric Non-Invasive Nanosensor for Viral Dectection Gadre, Anand
R2-08-09 Sticksensor Minimally invasive nanosensor for Continuous Monitoring of Bioanalysis Gadre, Anand
R2-08-08 Automated Determination of Height and Tilt of a Substrate Surface Within a Lithography System Ruan, Junru
R2-08-07 A Novel Method to Enhance 1.54um near infrared light emmision from Erbium doped silicon Mengbing,Huang; Naczas, Sebastian
R2-08-01 Chain-Scission Polyester PAG-Polymers (CSP3) Renamed: Chain scission polyester polymers for photoresists Brainard, Robert Revuru, Srividya
R2-07-21 Acid Free Anti reflective Coatings for 193nm Lithography Brainard, Robert
R2-07-16 Method of Determining Genetic Sequences for Controlled Complex Assembly Hartley,John ; Raghunathan, Sudharashanan; Ruan, Junru; Ozkan, Mihrl ; Akin, Rngin
R2-07-11 Stress Relief Layers for EUV and 193 nm Photoresists EUV Brainard, Robert
R2-06-14 Low temperature Immersion One Ninety-three (LION) Monomers Brainard, Robert
R2-06-13 Chain-Scission/CAMP Hybrid EUV Resists Brainard, Robert
R2-06-12.2 Acid Amplifiers for EUV Photoresists Brainard, Robert
R2-06-12.1 Acid Amplifiers for EUV Photoresists Brainard, Robert
R2-06-11 Resolution Enhancement Solution for 193nm Photoresists Renamed: Composition and Methods for Forming a Self-Aligned Double Pattern Brainard, Robert
R2-06-08 Method for Detecting Defects in Multi-layer EUV lithography Masks Matyi, Richard
R2-06-02 High Index Fluids for 193 nm Immersion Lithography Brainard, Robert; Block , Eric
R2-05-14 Maskless lithography with a very large array of simple pattern generators Hartley, John G.
R2-05-13 Registration system for maskless lithography Hartley, John G.
R2-04-09 High Pressure Gas Immersion Lithogrpahy Hartley, John G.
RN2-09-04 Novel Acid Amplifiers for Use in Photoresists Brainard, Robert

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MEMS

Case Number Disclosure Title Inventor(s)
RN2-12-14 New Forming method of HfOx 1T1R RRAM: First Fire Ye, Quiyi
RN2-12-07 Method for reducing charging in the CD SEM Melvin “Warren” Montgomery; Cecelia Montgomery (SEMATECH); Ben Bunday (SEMATECH)
R99-04-320 MEMS Device for Interconnect Applications Castracane, James
RN2-09-14 Cell Collecting Devices and Methods for Collecting Cells Castracane, James
RN2-09-01A Spatial Tuneable Pressure Plates for bonding wafer to wafer/die to wafer applications Altemus, Bruce
RN2-09-01 Piezoelectric Sensor Array for Pressure Uniformity/Spatial Verification Altemus, Bruce
R2-02-03 Real Time Processing Capillary Electrophoresis Method and Fabrication Using MEMS Technology Dong, Yan; Xu, Bai; Castracane, James
R2-08-18 Fluidic Devices for Cell Encapsulation and methods of Making Same of Biological applications Bergkvist, Magnus; Cady ,Nathaniel; Gracias, Allison; Xie, Yubling
R2-08-14 Porous Micro-Heater for Surface Dusruption and Controllled Sampling of Fluids Gadre, Anand
R2-08-10 Nano/Viral Sensor Conjugated Polymeric Non-Invasive Nanosensor for Viral Dectection Gadre, Anand
R2-08-09 Sticksensor Minimally invasive nanosensor for Continuous Monitoring of Bioanalysis Gadre, Anand
R2-04-02 MEMS based self caibrating systems for chemical sensors Carpenter, Michael A.
R2-03-10 MEMS Structure with Anodically Bonded Silicon-on-Insulator Substrate Xu, Bai, Tokranova, Natalya; Castracane James
R2-00-04 Mirror, Optical Switch and Method for Redirecting an Optical Signal Castracane, James

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Metrology

Case Number Disclosure Title Inventor(s)
RN2-12-14 New Forming method of HfOx 1T1R RRAM: First Fire Ye, Quiyi
RN2-12-07 Method for reducing charging in the CD SEM Melvin “Warren” Montgomery; Cecelia Montgomery (SEMATECH); Ben Bunday (SEMATECH)
RN2-11-16
Carbon nanotube growth on silicon and silicon nanowire substrates via simultaneous delivery of carbon and catalyst via plasma enhanced atomic layer deposition (PEALD)
Jae Ho Lee; Issac Lund; Eric Eisenbraun; Robert Geer
S830-320 Processes for Form Images with Nanometer Dimensions Corbett, James W.; Gibson, Walter M.; Kumakhov, Muradin A.
S745-320 Improved Method for Making a Mask and a Lithographic Pattern Corbett, James W.; Kaloyeros, Alain E.
RN2-09-15 Parallel Beam Scanning Mask Inspection Denbeaux, Greg
RN2-09-01A Spatial Tuneable Pressure Plates for bonding wafer to wafer/die to wafer applications Altemus, Bruce
RN2-09-01 Piezoelectric Sensor Array for Pressure Uniformity/Spatial Verification Altemus, Bruce
R2-08-15 Digital Deflection system for Changed Particle Applications Hartley, John
R2-08-03 Environmental X-ray Photoelectron Spectroscopy Theil, Bradley
R2-06-15 Direct Closed Loop Proportional-Integral- Derivaive (PID) Substraite Temperature Control for a Molecular Beam Epilaxy (MBE) Machine Via Input from a Band-Edge temperature measurement system LaBella, Vincent; Awo-Affouda, Chaffra; Stollenwerk, Andrew
R2-06-08 Method for Detecting Defects in Multi-layer EUV lithography Masks Matyi, Richard
R2-05-08 Ion beam deflector for FIB sample preparation Lifshin, Eric; Theil, Brad; Levine, Ernie
R2-02-02 Method for Enhancing the Resolution of SEM Lifshin, Eric; Moore, Richard

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Optoelectronics

Case Number Disclosure Title Inventor(s)
RN2-09-16 Method of creating Cs-free III-Nitride based Photocathodes Shahedipour-Sandvik, Fatemeh; Tripathi, Neeraj
RN2-09-15 Parallel Beam Scanning Mask Inspection Denbeaux, Greg
RN2-09-11 In-Situ Confined Plasma Channel Source for Enhanced Thin Films Uniformity Stewart, Stephen L.
RN2-09-01A Spatial Tuneable Pressure Plates for bonding wafer to wafer/die to wafer applications Altemus, Bruce
R2-07-09 Semi-conductor lasers with tunnel quantum well-on dots in GaAs - INAS as active medium Tokranov,Vadim; Otkyabrsky, Serge; Yakimov, Michael
R2-06-15 Direct Closed Loop Proportional-Integral- Derivaive (PID) Substraite Temperature Control for a Molecular Beam Epilaxy (MBE) Machine Via Input from a Band-Edge temperature measurement system LaBella, Vincent; Awo-Affouda, Chaffra; Stollenwerk, Andrew
R2-05-23 Oxidation liftoff technology for ultra thin active layer transfere and fabrication of silicon based laser diodes Otkyabrsky, Serge; Yakimov, Michael
R2-05-19 Aerial Image sensor for extreme Ultra violet lithography Naulleau, Patrick
R2-05-19.1 A transmission EUV holographic optical element for coherence control in EUV lithography and microscopy systems Naulleau, Patrick
R2-05-04 Optimized Etch for Zone Plate Optics Denbeaux, Gregory
R2-04-05 Nanosensor networks using optical communication Carpenter Michael A.; Goel, Sanjay; Bush, Stephen F.
R2-04-08 All optical high temperature compatable chemical sensor Carpenter, Michael A.
R2-03-11 Multiple Convergent Image Inspection System Denbeaux, Gregory
R2-03-08 Optical Methods and Systems for Detecting a Constituent in a Gas Containing Oxygen in Harsh Environments Carpenter, Michael A.
R2-03-01 Photoinc Chrystal Based beam Steering for Free Space Optical communications Systems Raynolds, James
R2-02-04 Substrate Engineering Technique for Low Dislocation Defect III-Nitride Wideband Gap Material (AllnGaN) Growth on Silicon Substrate Shahedipour-Sandvik, Fatemeh; Wu, Di, Kahn, Muhammad Jamil
R2-02-02 Method for Enhancing the Resolution of SEM Lifshin, Eric; Moore, Richard
R2-02-01 Infra-red focal plane optoelectronic up-converter Oktyabrsky,Serge
R2-07-03 Highly multiplex DNA analysis based upon Raman spectroscopy Cady, Nathaniel C.; Lednev , Igor K.

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RIE

Case Number Disclosure Title Inventor(s)
RN2-12-12
Sub 22nm Nanoimprint Lithography Integration and RIE processing
Stamper, Harlan; Bennett, Steve; Lovell, David
RN2-11-15 Amorphous Carbon and Side Wall Image Transfer (SIT) Stamper, Harlan

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