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Domenico DiPaola
Senior Lithography Process Engineer

Professional Background:

  • Lithography Process Engineer, College of Nanoscale Science and Engineering – Albany, NY (2011 – Present)
  • Lithography process engineer , IBM, Hopewell Junction, NY (2004 – 2011)
  • Lithography process engineer , Micron Technology – Boise, ID (2002 – 2004)
  • Lithography process engineer , IBM – Burlington, VT (2001-2002)
  • M.S. (Electrical Engineering), University of Idaho, Moscow, ID 2012 (Expected)
  • B.S. (Microelectronic Engineering), Rochester Institute of Technology, Rochester, NY 2001


As senior lithography process engineer for CNSE, Mr. DiPaola is responsible for the execution of advanced lithography-related joint development programs, including support of CNSE's advanced BEOL and FEOL lithography sector, SEMATECH and third party initiatives.

  • “Optimizing Models Based OPC Fragmentation using Genetic Algorithms” – PROCEEDINGS OF SPIE PHOTOMASK TECHNOLOGY 2008 v7122-30